Method and apparatus for depositing atomic layers on a substrate
US9297077B2 · kind B2 · utility
2Cited by
38References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2011 |
| Grant date | Mar 29, 2016 |
| Priority date | — |
| Expiry date | Feb 11, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67784
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Method of depositing an atomic layer on a substrate. The method comprises supplying a precursor gas from a precursor-gas supply of a deposition head that may be part of a rotatable drum. The precursor gas is provided from the precursor-gas supply towards the substrate. The method further comprises moving the precursor-gas supply by rotating the deposition head along the substrate which in its turn is moved along the rotating drum.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.