Method for cutting substrate
US9299613B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 7, 2014 |
| Grant date | Mar 29, 2016 |
| Priority date | — |
| Expiry date | Jul 7, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/78
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for cutting a substrate includes: radiating, as part of a first laser radiating process, a laser towards a surface of the substrate to form a first groove in a substrate. Radiating the laser towards the surface includes radiating, in sequence, the laser towards a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP) of the surface, each of the points being spaced apart from one another by one or more distances. The FCP corresponds to a cut line of the substrate. The FOP and the SOP are respectively disposed at lateral sides of the FCP. The FIP is disposed between the FCP and the FOP. The SIP is disposed between the FCP and the SOP. The same kind and intensity of laser is radiated towards each of the points.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.