Electronic component can package structure
US9299625B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2014 |
| Grant date | Mar 29, 2016 |
| Priority date | — |
| Expiry date | Dec 17, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49945
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic component can package structure with a can case having an elliptically-shaped cavity in a state before it is fitted with a supporting base portion of a stem. The supporting base portion of the stem has a circular shape. The cavity of the can case is fitted with the supporting base portion of the stem with elastic deformation of the can case. The long diameter of the cavity has an allowance relative to the outer diameter of the supporting base portion of the stem and a gap for the allowance acts as a contraction margin. The short diameter of the cavity is smaller than the outer diameter of the supporting base portion of the stem, so that the supporting base portion is held between the short diameter portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.