Die package structure
US9299626B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 18, 2013 |
| Grant date | Mar 29, 2016 |
| Priority date | — |
| Expiry date | Oct 23, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die packaged structure includes a pad on the central region of the die. A packaged substrate with an opening disposed in the central region, and a connecting terminal is passed through the packaged substrate and disposed around the opening. An external connecting terminal is disposed on the four sides of the packaged substrate. A first metal wire is electrically connected the connecting terminal with the external connecting terminal, and the back of the packaged substrate is fixed on the die, such that the pad is exposed on the opening. A second metal wire is electrically connected the pad with the connecting terminal. A packaged body is encapsulated the packaged substrate, the die and the second metal wire, and the external connecting terminal is exposed. A conductive component is electrically connected with the external connecting terminal and is arranged on the four sides of the die packaged structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.