Heat sink for electronic device and process for production thereof
US9299636B2 · kind B2 · utility
2Cited by
0References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2010 |
| Grant date | Mar 29, 2016 |
| Priority date | — |
| Expiry date | Jul 1, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/32225
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A heat sink for an electronic device includes a Cr—Cu alloy layer including a Cu matrix and more than 30 mass % and not more than 80 mass % of Cr; and Cu layers provided on top and rear surfaces of the Cr—Cu alloy layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.