Anisotropic conductive film composition, anisotropic conductive film, and semiconductor device
US9299654B2 · kind B2 · utility
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2References
7Claims
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Key dates
| Filing date | Dec 13, 2012 |
| Grant date | Mar 29, 2016 |
| Priority date | — |
| Expiry date | Oct 6, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/07811
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A semiconductor device is bonded by an anisotropic conductive film composition. The anisotropic conductive film composition includes an ethylene-vinyl acetate copolymer, a polyurethane resin, and organic fine particles. The anisotropic conductive film composition has a melt viscosity of about 2,000 to about 8,000 Pa·s at 80° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.