Conductive particle and method of manufacturing the same
US9301392B2 · kind B2 · utility
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26Claims
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Key dates
| Filing date | Nov 23, 2012 |
| Grant date | Mar 29, 2016 |
| Priority date | — |
| Expiry date | Mar 19, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is a conductive particle, including: a base particle containing a metal; a seed particle formed on a surface of the base particle; and a first metal layer formed on the base particle, wherein the first metal layer includes a protrusion surrounding the seed particle. The conductive particle has excellent specific resistance characteristics when it is sintered because it has nanosized protrusions formed on the surface of a metal base particle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.