Patent · US Active

Manufacturing method and electronic module with new routing possibilities

US9301394B2 · kind B2 · utility

0Cited by

2References

20Claims

0Family size

Assignee

GE Embedded Electronics Oy · FI

Inventors

Antti Kivikero · Tuusula, FI
Pekka Kostensalo · Lahti, FI
Jaakko Hekki Tapie Moisala · Munich, DE

Key dates

Filing date	May 19, 2010
Grant date	Mar 29, 2016
Priority date	—
Expiry date	May 29, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Disclosed is an electronic module with high routing efficiency and other new possibilities in conductor design. The electronic module comprises a wiring layer (3), a component (1) having a surface with contact terminals (2) and first contact elements (6) that connect at least some of the contact terminals (2) to the wiring layer (3). The electronic module is provided with at least one conducting pattern (4) on the surface of the component (1) but spaced apart from the contact terminals (2). The electronic module further comprises a dielectric (5) and at least one second contact element (7) that connects the conducting pattern (4) to the wiring layer (3) through a portion of said dielectric (5). Methods of manufacturing such modules are also disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.