Method for manufacturing microthrough-hole in circuit board and circuit board structure with microthrough-hole
US9301405B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2015 |
| Grant date | Mar 29, 2016 |
| Priority date | — |
| Expiry date | Jan 26, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09536
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing microthrough-hole includes electroplating a metal layer on a carrier plate, patterning the metal layer to form a first circuit having copper pads, covering the first circuit with a photoresist layer and not covering the copper window between two of the copper pads, etching the metal layer beneath the copper window and removing the photoresist layer, sequentially forming an insulation layer and a second circuit on the first circuit and the copper window, the second circuit layer having a stop pad corresponding to the copper window, removing the carrier plate, upward drilling through the insulation layer between the stop pad and the copper window to form a microthrough-hole beneath the stop pad, and forming a conductive layer in the microthrough-hole to form the microthrough-hole connecting the first and second circuits. The microthrough-hole and its occupied area is greatly reduced, thereby achieving high circuit density.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.