Method of manufacturing substrate having cavity
US9301407B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2014 |
| Grant date | Mar 29, 2016 |
| Priority date | — |
| Expiry date | Dec 10, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10204
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The method of manufacturing a substrate includes: forming a penetrating hole in a base layer; inserting a metal dummy part in the penetrating hole; forming an insulating portion made of synthetic resin to fill a ring-shaped gap between the penetrating hole and the dummy part; forming lower insulating layers, covering the bottom surface of the dummy part, that are made of synthetic resin on the bottom surface of the base layer to be continuous with the insulating portion; forming upper insulating layers, covering the top surface of the dummy part, that are made of synthetic resin on the top surface of the base layer to be continuous with the insulating portion; forming an exposing hole by routing in the upper insulating layers to expose the top surface of the dummy part; and forming a cavity by removing the dummy part exposed through the exposing hole by etching.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.