Method for cutting object to be processed
US9302410B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2010 |
| Grant date | Apr 5, 2016 |
| Priority date | — |
| Expiry date | Jul 21, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1052
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A silicon substrate 12 has a main face in a (100) plane, whereby a fracture 17 generated from a molten processed region 13 acting as a start point extends in a cleavage direction of the silicon substrate 12 (a direction orthogonal to the main face of the silicon substrate 12). Here, a rear face 1b of an object to be processed 1A and a front face 10a of an object to be processed for separation 10A are bonded to each other by anode bonding, whereby the fracture 17 reaches a front face 1a of the object 1A continuously without substantially changing its direction. When generating a stress in the object for separation 10A, the fracture 17 has reached a rear face 10b of the object for separation 10A and thus easily extends toward the object 1A.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.