Patent · US Active

Electrochemical deposition apparatus with remote catholyte fluid management

US9303329B2 · kind B2 · utility

1Cited by
71References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 11, 2013
Grant dateApr 5, 2016
Priority date
Expiry dateFeb 25, 2034

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/2885
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

Techniques disclosed herein include an electro-chemical deposition apparatus that provides an efficient circulation system, chemical management that provides reliable and uniform plating, and a configuration that provides short maintenance times and greater tool availability. Techniques include a processing tank containing an anolyte fluid, and one or more plating cells each having a catholyte fluid compartment with a circulation path that connects to a separate or remote catholyte reservoir. Thus, with such a configuration, a single pump can be used to flow catholyte (via manifolds) through one or more plating cells. Thus, with the catholyte reservoir maintained off board, instead of dumping catholyte over a weir into a reservoir, catholyte fluid—after flowing through a plating cell—is returned to the catholyte reservoir.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.