System and method for lithography alignment
US9304403B2 · kind B2 · utility
59Cited by
11References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 2, 2013 |
| Grant date | Apr 5, 2016 |
| Priority date | — |
| Expiry date | Apr 12, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F9/7084
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present disclosure provides one embodiment of a lithography system for integrated circuit making. The system includes a substrate stage designed to secure a substrate and being operable to move the substrate; an alignment module that includes a tunable light source being operable to generate an infrared light with a wavelength tunable; and a detector to receive the light; and an exposing module integrated with the alignment module and designed to performing an exposing process to a resist layer coated on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.