Method of manufacturing a card of small thickness detachable from a plate of large thickness
US9305254B2 · kind B2 · utility
0Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2012 |
| Grant date | Apr 5, 2016 |
| Priority date | — |
| Expiry date | Dec 21, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/0481
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a card (3) of small format (8) and small thickness (5), detachable from a plate (1) of large thickness (6), includes the following steps: providing in the plate (1) of large thickness (6) at least one hole (4) opposite with a cumulative depth (7) equal to the difference between the large thickness (6) and the small thickness (5), pre-cutting of the card (3) of small format (8) in the at least one hole (4). The product obtained by such a method is also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.