Methods and devices for securing and transporting singulated die in high volume manufacturing
US9305816B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2013 |
| Grant date | Apr 5, 2016 |
| Priority date | — |
| Expiry date | Dec 28, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0084
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.