Cycling heat dissipation module
US9305860B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 24, 2014 |
| Grant date | Apr 5, 2016 |
| Priority date | — |
| Expiry date | Oct 7, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cycling heat dissipation module is used for removing the heat generated by a heat-generating element of a circuit board and includes at least one main body and at least one conducting pipe. The main body has a chamber and a heat guiding part. The chamber is filled with a fluid and has a wall to divide the chamber into a first compartment and a second compartment adjacent to each other. The heat guiding part is used for conducting the heat generated from the heat generating element. The conducting pipe has a first end, a second end and a heat exchanging section. The fluid is pushed into the heat-exchanging section by the pressure difference after absorbing the heat of the heat guiding part, and then moved to the second compartment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.