Semiconductor device
US9305910B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 7, 2015 |
| Grant date | Apr 5, 2016 |
| Priority date | — |
| Expiry date | May 7, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes an insulating substrate having a first conductive pattern on a first insulating substrate; a first semiconductor element having one surface fixed to the first conductive pattern; a printed circuit board having a conductive layer on a second insulating substrate and a plurality of metal pins fixed to the conductive layer; and a third insulating substrate. A portion of pins constituting the metal pins is fixed to other surface of the first semiconductor element, and the printed circuit board with the metal pins is sandwiched between the insulating substrate having the first conductive pattern and the third insulating substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.