Surface-mounted microphone arrays on flexible printed circuit boards
US9307326B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 21, 2010 |
| Grant date | Apr 5, 2016 |
| Priority date | — |
| Expiry date | Feb 5, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2430/23
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A microphone array, having a three-dimensional (3D) shape, has a plurality of microphone devices mounted onto (at least one) flexible printed circuit board (PCB), which is bent to achieve the 3D dimensional shape. Output signals from the microphone devices can be combined (e.g., by weighted or unweighted summation or differencing) to form sub-element output signals and/or element output signals, and ultimately a single array output signal for the microphone array. The PCB may be uniformly flexible or may have rigid sections interconnected by flexible portions. Possible 3D shapes include (without limitation) cylinders, spirals, serpentines, and polyhedrons, each formed from a single flexible PCB. Alternatively, the microphone array may be an assembly of multiple, interconnecting sub-arrays, each having two or more rigid portions separated by one or more flexible portions, where each sub-array has at least one cut-out portion for receiving a rigid portion of another sub-array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.