Multilayered substrate and method of manufacturing the same
US9307632B2 · kind B2 · utility
9Cited by
2References
21Claims
0Family size
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Key dates
| Filing date | Dec 30, 2013 |
| Grant date | Apr 5, 2016 |
| Priority date | — |
| Expiry date | May 8, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayered substrate and a method of manufacturing the same. The multilayered substrate includes a plurality of wiring layers and reinforcing layers disposed at the outermost portions of both surfaces of the multilayered substrate, respectively, in order to decrease warpage of the multilayered substrate and has wiring patterns optimized depending on a scheme in which external electrodes are formed on an electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.