PCB pad for imager of vehicle vision system
US9307640B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 18, 2013 |
| Grant date | Apr 5, 2016 |
| Priority date | — |
| Expiry date | Apr 18, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board for an image processing chip of a vision system of a vehicle is configured for a surface mount device to be attached thereto and includes at least one mounting location having a plurality of solder pads established thereat. The pads are arranged in a manner that enhances soldering of the device or component to the pad and circuit board. The pads may be arranged similarly in respective portions of the mounting location, such that the pads of one portion of the mounting location may be generally parallel to one another and may be generally orthogonal to the pads of another portion of the mounting location. Optionally, the pads may be generally tear-drop shaped, and the tear-drop shaped pads may be arranged so as to point generally towards or generally away from a center area of the mounting location of the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.