Mixed-metal system conductors for use in low-temperature co-fired ceramic circuits and devices
US9307649B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2014 |
| Grant date | Apr 5, 2016 |
| Priority date | — |
| Expiry date | Sep 30, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A composition for forming transition vias and transition line conductors is disclosed for minimizing interface effects at electrical connections between dissimilar metal compositions. The composition has (a) inorganic components selected from the group consisting of (i) 20-45 wt % gold and 80-55 wt % silver and (ii) 100 wt % silver-gold solid solution alloys, and (b) an organic medium. The composition may also contain (c) 1-5 wt %, based upon the weight of the composition, of oxides or mixed oxides of metals selected from the group consisting of Cu, Co, Mg and Al and/or high viscosity glasses mainly containing refractory oxides. The composition may be used as a multi-layer composition in a via fill. Multi-layer circuits such as LTCC circuits and devices may also be formed using the composition for forming transition vias and transition line conductors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.