Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component
US9307674B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 6, 2011 |
| Grant date | Apr 5, 2016 |
| Priority date | — |
| Expiry date | Sep 27, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20936
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.