Permeated grooving in CMP polishing pads
US9308620B2 · kind B2 · utility
15Cited by
10References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2013 |
| Grant date | Apr 12, 2016 |
| Priority date | — |
| Expiry date | Jan 14, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/24
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad for polishing a semiconductor wafer or other materials, having grooves in the polishing pad to enhance the usable lifetime of the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.