Installation assembly and associated method for forming a bonded joint
US9308688B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2013 |
| Grant date | Apr 12, 2016 |
| Priority date | — |
| Expiry date | Oct 10, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B38/1833
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An installation assembly and an associated method for forming a bonded join are provided to permit the adhesive attachment of a first workpiece, such as a patch, to a portion of a second workpiece. The installation assembly and the associated method provide for at least partial debulking of the adhesive prior to curing of the adhesive such that the resulting bondline may have improved mechanical properties as a result of having fewer voids and/or porosity. The installation assembly may include an installation stand and a carrier plate supported by the installation stand and including an attachment surface configured to carry the first workpiece. The installation stand also includes an adjustment mechanism for positioning a carrier plate to a first predefined position to define a gap between the first and second workpieces and also to a second predefined position such that a predetermined bondline thickness is defined between the first and second workpieces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.