Bonding apparatus and method
US9308709B2 · kind B2 · utility
0Cited by
83References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 6, 2013 |
| Grant date | Apr 12, 2016 |
| Priority date | — |
| Expiry date | Oct 15, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1744
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Apparatus and method are disclosed for heat bonding or welding a thermoplastic component to a sealing member such as a film or foil having a thermoplastic portion. The apparatus preferably includes a 3-axis arrangement for accurate and repeatable positioning of the component and foil during bonding and for variation of bonding parameters, such as material, pressure, temperature and/or time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.