Bonding of nonwoven materials
US9309080B2 · kind B2 · utility
0Cited by
5References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2012 |
| Grant date | Apr 12, 2016 |
| Priority date | — |
| Expiry date | Dec 15, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65H2701/177
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
This invention relates to a technology for bonding pieces of nonwoven material to each other by fluid entanglement or needling technology.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.