Patent · US Active

Bonding of nonwoven materials

US9309080B2 · kind B2 · utility

0Cited by
5References
15Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 30, 2012
Grant dateApr 12, 2016
Priority date
Expiry dateDec 15, 2034

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB65H2701/177
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

This invention relates to a technology for bonding pieces of nonwoven material to each other by fluid entanglement or needling technology.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.