Composition for tungsten buffing
US9309442B2 · kind B2 · utility
2Cited by
39References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2014 |
| Grant date | Apr 12, 2016 |
| Priority date | — |
| Expiry date | Apr 19, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23F3/06
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A chemical mechanical polishing composition for polishing a substrate having a tungsten layer includes a water based liquid carrier and colloidal silica abrasive particles dispersed in the liquid carrier. The colloidal silica abrasive particles have a permanent positive charge of at least 6 mV. About 30 percent or more of the colloidal silica abrasive particles include three or more aggregated primary particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.