Heat flow device
US9310145B2 · kind B2 · utility
32Cited by
18References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2012 |
| Grant date | Apr 12, 2016 |
| Priority date | — |
| Expiry date | Sep 23, 2034 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2270/00
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A device comprises equipment (101) with a heat source, a cold part (102) relative to the equipment, and a thermal conductor element (103) capable of conducting the heat from the equipment to the cold part. The element (103) is such that, under certain thermal conditions above a given thermal condition, the equipment and the cold part are essentially thermally isolated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.