Differential pressure sensor
US9310267B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2014 |
| Grant date | Apr 12, 2016 |
| Priority date | — |
| Expiry date | Sep 23, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L2009/0066
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A differential pressure sensor includes a pressure sensing die comprising a semiconductor die, having a thinned portion forming a diaphragm. The diaphragm includes piezo-resistive elements that exhibit varying resistance based on force exerted on the diaphragm. A first support structure is bonded to a first surface of the semiconductor die, having an aperture defined through the support structure such that a first surface of the diaphragm is exposed through the aperture. A second support structure is bonded to the opposite side of the semiconductor die having an aperture aligned with the opposing side of the diaphragm. Electrical components in electrical communication with the piezo-resistive elements are arranged outside the region defined by the bond between the first and second support structures and the semiconductor die. An oil-filled volume may be defined between the semiconductor die and a harsh medium which transmits a fluid pressure to the die without the harsh medium contacting the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.