Heat dissipating module with enhanced heat dissipation efficiency and electronic device therewith
US9310858B2 · kind B2 · utility
3Cited by
1References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 18, 2013 |
| Grant date | Apr 12, 2016 |
| Priority date | — |
| Expiry date | Mar 11, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipating module includes a main body, a heat dissipating unit and at least one resilient engaging unit. A side of the heat dissipating unit is connected to the main body and the other side of the heat dissipating unit contacts against at least one heat component. An end of the at least one resilient engaging unit is connected to a side of the main body and the other end of the at least one resilient engaging unit engages with a side of a fastening base. The at least one resilient engaging unit is for resiliently pressing the main body so that the dissipating unit contacts with the at least one heat component closely.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.