Liquid cooling of multiple components on a circuit board
US9310859B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2013 |
| Grant date | Apr 12, 2016 |
| Priority date | — |
| Expiry date | May 31, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An apparatus includes a primary cold plate, a secondary cold plate, and spring biased retainers moveably securing the primary cold plate to the secondary cold plate. The secondary cold plate is securable to a circuit board for thermal engagement with heat-generating components on the circuit board. The primary cold plate is aligned for thermal engagement with a processor on the circuit board and includes an internal liquid cooling channel. The apparatus further comprises compressible thermal interface material disposed between the primary cold plate and the secondary cold plate to conduct heat from the secondary cold plate to the primary cold plate and remove the heat in a liquid flowing through the liquid cooling channel. The apparatus provides thermal engagement and cooling of multiple components having different heights.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.