Detecting defects on a wafer using template image matching
US9311698B2 · kind B2 · utility
5Cited by
273References
35Claims
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Key dates
| Filing date | Jan 9, 2013 |
| Grant date | Apr 12, 2016 |
| Priority date | — |
| Expiry date | Apr 4, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various embodiments for detecting defects on a wafer are provided. Some embodiments include matching a template image, in which at least some pixels are associated with regions in the device having different characteristics, to output of an electron beam inspection system and applying defect detection parameters to pixels in the output based on the regions that the pixels in the output are located within to thereby detect defects on the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.