Integrated connector modules for extending transformer bandwidth with mixed-mode coupling using a substrate inductive device
US9312059B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2013 |
| Grant date | Apr 12, 2016 |
| Priority date | — |
| Expiry date | Oct 18, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4902
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An improved low cost and highly consistent inductive apparatus. In one embodiment, the low cost and highly consistent inductive apparatus addresses concerns with so called conductive anodic filament (CAF) that occurs within these laminate structures. These conditions include high humidity, high bias voltage (i.e. a large voltage differential), high-moisture content, surface and resin ionic impurities, glass to resin bond weakness and exposure to high assembly temperatures that can occur, for example, during lead free solder bonding application. In a variant, mixed mode coupling techniques are utilized in order to extend the underlying operating bandwidth of the substrate inductive device. Methods of manufacturing and using the aforementioned substrate inductive devices are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.