Patent · US Active

Interconnection of several levels of a stack of supports for electronic components

US9312169B2 · kind B2 · utility

0Cited by

2References

12Claims

0Family size

Assignee

COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventors

Christophe Bouvier · Grenoble, FR
Gabriel Pares · Bernin, FR

Key dates

Filing date	Aug 7, 2014
Grant date	Apr 12, 2016
Priority date	—
Expiry date	Aug 7, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH10D88/00
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Method for producing a microelectronic device formed from a stack of supports (W) each provided with one or more electronic components (C) and comprising a conductive structure (170, 470) formed from a first blind conductive via (171b, 472) and a second blind conductive via (171a, 473) with a greater height, the first via and the second via being connected together.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.