Bump structures having an extension
US9312213B2 · kind B2 · utility
2Cited by
7References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2013 |
| Grant date | Apr 12, 2016 |
| Priority date | — |
| Expiry date | Aug 29, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bump structure may include a body portion spaced apart from a pad disposed on a substrate and a first extension extending from a side of the body portion onto the pad. A second extension extends from another side of the body portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.