Light-emission element assembly and method of manufacturing same, as well as display
US9312461B2 · kind B2 · utility
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14Claims
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Key dates
| Filing date | Mar 24, 2014 |
| Grant date | Apr 12, 2016 |
| Priority date | — |
| Expiry date | Mar 24, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12042
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light-emission element assembly includes: a light-emission element; a mold section in which the light-emission element is molded; a pad section protruding from an undersurface of the mold section, and electrically connected to the light-emission element; and a reinforcement section provided in the pad section, and projecting towards a side on which the mold section is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.