Electronic system with heat extraction and method of manufacture thereof
US9313874B2 · kind B2 · utility
0Cited by
122References
7Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 19, 2013 |
| Grant date | Apr 12, 2016 |
| Priority date | — |
| Expiry date | Jan 19, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic system, and a method of manufacture thereof, including: a substrate; an electrical device over the substrate; and a surface mount heat sink next to the electrical device, the surface mount heat sink having an extruded shape characteristic of being formed using an extrusion mechanism.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.