Conformal coating including embedded thermal energy absorbing material
US9313875B2 · kind B2 · utility
5Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2012 |
| Grant date | Apr 12, 2016 |
| Priority date | — |
| Expiry date | Nov 29, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/2039
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Examples are disclosed for a conformal coating molded around power source circuitry, electrical components or at least portions of a display for a computing device. The conformal coating to include embedded microencapsulated thermal energy storage material to absorb heat generated by the electrical components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.