Multi-component heatsink with self-adjusting pin fins
US9313923B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 7, 2014 |
| Grant date | Apr 12, 2016 |
| Priority date | — |
| Expiry date | Sep 23, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10598
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heatsink includes a rigid plate and a plurality of pin fins. The plate has a two dimensional array of holes through the rigid plate from a first face to a second face. Each pin fin is received in one of the holes and has a proximal end extending beyond the first face of the plate for conductively receiving heat, a distal end extending beyond the second face of the plate for convective heat exchange with air, a biasing member biasing the pin fin in a proximal direction, and a shoulder limiting the proximal extension of the pin fin through the hole. An apparatus may include the pin fin heatsink secured to a printed circuit board having at least two components that have different heights. Accordingly, each component is contacted by the proximal end of one or more self-adjusting pin fins that are aligned with the component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.