Cooling heat-generating electronics
US9313926B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2014 |
| Grant date | Apr 12, 2016 |
| Priority date | — |
| Expiry date | May 6, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A server rack sub-assembly includes at least one motherboard having a perimeter; a plurality of heat-generating electronic devices mounted on the motherboard in an area of the motherboard thermally decoupled from the motherboard perimeter; one or more brackets including heat transfer surfaces and attached to the motherboard along at least a portion of the motherboard perimeter; and a heat transfer device thermally coupled to the area of the motherboard that is thermally decoupled from the motherboard perimeter and the one or more brackets. The one or more brackets are adapted to receive a cooling airflow circulated over the bracket and to convectively transfer heat into the cooling airflow and are further adapted to couple the motherboard to a server rack assembly. The heat transfer device is arranged to conductively transfer heat from the one or more electronic devices to the brackets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.