Electronic control apparatus for vehicle using sloped structure and method thereof
US9313936B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2013 |
| Grant date | Apr 12, 2016 |
| Priority date | — |
| Expiry date | Jul 11, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to an electronic control apparatus for a vehicle using a sloped structure, and a manufacturing method thereof, in which an appropriate space is maintained with a housing body in order to maintain thermal glue applied onto the PCB when assembling an electronic control apparatus in a sliding manner, and the PCB is assembled by making the PCB be in contact with an upper housing body along a sloped structure formed in a distal end housing at a point at which the slide type assembling is ended, so that the thermal glue may be uniformly applied onto the PCB and be maintained during a slide type manufacturing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.