Methods for vacuum assisted underfilling
US9314882B2 · kind B2 · utility
5Cited by
29References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2014 |
| Grant date | Apr 19, 2016 |
| Priority date | — |
| Expiry date | Mar 17, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01029
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods for applying an underfill with vacuum assistance. The method may include dispensing the underfill onto a substrate proximate to at least one exterior edge of an electronic device attached to the substrate. A space between the electronic device and the substrate is evacuated through at least one gap in the underfill. The method further includes heating the underfill to cause the underfill to flow into the space. Because a vacuum condition is supplied in the open portion of the space before flow is initiated, the incidence of underfill voiding is lowered.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.