Surface flaw modification for strengthening of glass articles
US9315412B2 · kind B2 · utility
1Cited by
7References
22Claims
0Family size
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Key dates
| Filing date | Jul 3, 2012 |
| Grant date | Apr 19, 2016 |
| Priority date | — |
| Expiry date | Oct 21, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K2323/061
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Disclosed are controlled chemical etching processes used to modify the geometry of surface flaws in thin glass substrates and glass substrate assemblies formed therefrom, and in particular glass substrates suitable for the manufacture of active matrix displays that are essentially free of alkali metal oxides such as Na2O, K2O and Li2O.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.