Photocurable composition and encapsulated apparatus prepared using the same
US9315606B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2014 |
| Grant date | Apr 19, 2016 |
| Priority date | — |
| Expiry date | Jul 21, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A photocurable composition, a composition for encapsulation of an organic light emitting diode, and an encapsulated apparatus, wherein, in the photocurable composition, when A represents a glass-metal alloy die shear strength in kgf between a glass substrate and a Ni/Fe alloy after curing, and B represents curing shrinkage in % as determined by Equation 1, below, and the photocurable composition has a value for A/B of about 0.7 kgf/% or more and the glass-metal alloy die shear strength of about 2.5 kgf or more,Curing shrinkage=|(Specific gravity of solid photocurable composition after curing)−(Specific gravity of liquid photocurable composition before curing)|/(Specific gravity of liquid photocurable composition before curing)×100. <Equation 1>
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.