Laser to chip coupler
US9316788B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 13, 2011 |
| Grant date | Apr 19, 2016 |
| Priority date | — |
| Expiry date | Dec 10, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method and an apparatus for butt-coupling an input beam incoming from a photonic device of a second optical element to a primary photonic chip at an input interface of the primary photonic chip is disclosed. The primary photonic chip comprises a coupling apparatus. The light from the input beam is butt-coupled to the coupling apparatus. The coupling apparatus comprises a plurality of more than one single mode optical paths on the primary photonic chip. The single mode optical paths are strongly coupled to each other at the input interface of the primary photonic chip. Regions of strongly coupled single mode optical paths can correspond to one or both of distinct but highly coupled waveguides or waveguides fully merged into a multi-mode section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.