Storage device backplane with penetrating convection and computer framework
US9317078B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 4, 2014 |
| Grant date | Apr 19, 2016 |
| Priority date | — |
| Expiry date | Aug 6, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20727
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A storage device backplane with penetrating convection and a computer framework with the storage device backplane are disclosed. The storage device backplane includes an integration board, an operation board and a heat dissipation unit. The integration board has a first surface for electrically connecting the storage device group. The operation board is superposed on and electrically connected to a second surface of the integration board and is provided that the operation board includes an electronic heating active element (EHAE) and an airflow hole set around the EHAE. The heat dissipation unit includes a heat absorb portion and multiple fins set on the heat absorb portion. The heat absorb portion makes a thermal contact with the EHAE. The fins laterally extend to cover the airflow hole. Airflow passages are formed between the fins corresponding to the airflow hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.