Method for producing a multiplicity of optoelectronic semiconductor components

US9318357B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Martin Brandl · Kelheim, DE
• Markus Boss · Regensburg, DE
• Markus Pindl · Tegernheim, DE
• Simon Jerebic · Regensburg, DE
• Herbert Brunner · Sinzing, DE
• Tobias Gebuhr · Regensburg, DE

Key dates

• Filing date: Oct 14, 2013
• Grant date: Apr 19, 2016
• Expiry date: Oct 14, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/857
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Optoelectronic semiconductor devices and methods for producing optoelectronic semiconductor devices are disclosed. In an embodiment the method includes applying a plurality of arrangements of electrically conductive first and second contact elements on an auxiliary carrier, applying an optoelectronic semiconductor chip on the second contact element of each arrangement and electrically conductively connecting the optoelectronic semiconductor chip to the first contact element for each arrangement. The method further includes encapsulating the first contact elements and the second contact elements with an encapsulation material to form an encapsulation body and singulating the encapsulation body into a plurality of optoelectronic semiconductor devices, wherein the encapsulation material finishes flush with an underside, facing the auxiliary carrier, of each first contact element, and wherein the encapsulation material finishes flush with an underside, facing the auxiliary carrier, of each second contact element.