Resin composition, prepreg and resin sheet and metal foil-clad laminate
US9318402B2 · kind B2 · utility
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17Claims
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Key dates
| Filing date | Mar 22, 2012 |
| Grant date | Apr 19, 2016 |
| Priority date | — |
| Expiry date | Aug 21, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/012
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition is provided which can be suitably used in a printed circuit board having excellent electrical properties, heat resistance and peel strength, with flame retardancy maintained, a prepreg and resin sheet which use the same, and a metal foil-clad laminate which uses the prepreg. A resin composition including a polyphenylene ether (A), a specific phosphorus-containing cyanate ester compound (B), a non-halogenated epoxy resin (C), a cyanate ester compound (D) and a filler (E) is used.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.