Flip-chip hybridisation of two microelectronic components using a UV anneal
US9318453B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2013 |
| Grant date | Apr 19, 2016 |
| Priority date | — |
| Expiry date | Jul 31, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a microelectronic device including a first component hybridized with a second component via electric interconnects, involves the steps of: (i) forming the first and second components, the second component being transparent to ultraviolet radiation at least in line with locations provided for the interconnects; (ii) forming interconnection elements including copper oxide on the second component at the locations provided for the interconnects; (iii) placing the first and second components on each other; and (iv) applying the ultraviolet radiation through the second component on the elements including copper oxide to implement an ultraviolet anneal converting copper oxide into copper.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.