Method of forming a conductive pattern, method of manufacturing a display substrate using the method, and display substrate
US9318515B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | Aug 20, 2012 |
| Grant date | Apr 19, 2016 |
| Priority date | — |
| Expiry date | Feb 25, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/60
Abstract
A method of forming a conductive pattern includes forming a trench on a substrate, and providing a conductive ink to the trench while an electric field is generated between the substrate and a nozzle which ejects the conductive ink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.